Our rigid-flex domestic and international PCB suppliers manufacture advanced-technology circuit boards that consist of multiple layers of flexible circuit substrates attached to one or more rigid boards. The depth and breadth of specialties available include microwave and Microwave RF boards, heat sinks and thermal management, controlled impedance, HDI blind or buried vias, carbon ink PCBs and edge plating / castellation. Further, our medical and healthcare-focused suppliers add flexible heating capability, flat flex and membrane switches, plastic moldings, EO sterilization, battery monitoring and more. The markets we serve are constantly evolving and demand time-critical and technologically superior printed circuit boards. Scroll down for categories and technical specifications. Send us a note [Let’s talk] below for further discussion.
FR4, aluminum, teflon, copper bases and more
HASL, ENIG, OSP, immersion silver & immersion tin
Single-sided to 32 layers
Down to .003″
Up to 21″x 26″
Up to .250″
0.5 – 4oz. inner / 1-20 oz. outer
Mixed dielectric (hybrid) constructions; embedded coin, or metal core and metal backed MLB; blind and buried vias, via-in-pad, plated over-filled Vias (POFV); serialization; control-depth drilling (stub removal); plasma etchback; castellated vias; edge elating; plated slots / countersink / counterbores
Polyimide, PET
Single-sided to multi-layer
0.1mm to 0.5mm
0.5 oz. to 2 oz.
ENIG, OSP, immersion silver
Flexible solder mask; numerous colors available
Polyimide, FR4
Up to 24 layers
0.2 mm to 3.2 mm
0.5 – 4 oz. inner / 1 – 20 oz. outer
ENIG, OSP, immersion silver and more
Flexible solder mask; numerous colors available
Heatsink application for thermal management; loose leaf, bonded and bookbinder flex constructions; ITAR and non-ITAR capabilities; rigid-flex with high-density interconnect (HDI) technology.
Single-sided to 32 layers
1+N+1, 2+N+2, 3+N+3, 4+N+4, ELIC, Ultra HDI
FR4, Rogers and many more
0.5 – 4 oz. inner / 1 – 20 oz. outer
1.2 / 1.2 mil
0.40 mm – 3.20 mm
OSP, ENIG, immersion tin, immersion silver, electrolytic gold and many
0.15 mm
0.10 mm standard; 0.075
Single-sided to multi-layer
Aluminum and copper plates; FR-4, PTFE , thermal dielectrics
0.05 mm – 0.20 mm
1-12 W/m/K
Punching; liquid cooled routing
0.5 – 4 oz. inner / 1 – 20 oz. outer
Down to .003″
0.40 mm – 3.20 mm
HASL, LF HASL, OSP, ENIG, immersion tin, immersion silver and many more
Single-sided to 24 layers
Hybrid stack-ups with PTFE and non-PTFE
ENIG, immersion tin, OSP and more
Up to four cycles
0.75:1
10:1
5 mil for mechanical drill; 3.5 mil for laser drill
Minimum 12-mil hole and +/-1 mil depth tolerance
+0.5 mil – laser routing; +/-3 mil – mechanical routing
Selective & full-body hard / soft gold plating to 120µ
Countersink holes; castellations; cavities;
edge plating; buried via / blind via / microvia; gold fingers